Philips Semiconductors
13. Package outline
Plastic surface mounted package; 6 leads
74LVC1G175
Single D-type flip-flop with reset; positive-edge trigger
SOT363
D
B
E
A
X
y
6
5
4
pin 1
index
1
2
e1
bp
e
3
wM B
HE
vM A
A
A1
Q
c
Lp
detail X
0
1
scale
2 mm
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
max
bp
c
D
E
e
e1
HE Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30 0.25
0.20 0.10
2.2
1.8
1.35 1.3
1.15
0.65
2.2 0.45 0.25
2.0 0.15 0.15
0.2
0.2
0.1
OUTLINE
VERSION
IEC
SOT363
REFERENCES
JEDEC
EIAJ
SC-88
Fig 9. Package outline SOT363 (SC-88).
9397 750 13762
Product data sheet
Rev. 01 — 18 October 2004
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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