Philips Semiconductors
Quad buffer/line driver; 3-state
Product specification
74ALVC125
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
c
y
Z
14
8
E
A
X
HE
vM A
pin 1 index
1
e
7
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (2)
e
HE
mm
1.10
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
SOT402-1
MO-153
L
Lp
Q
1.0
0.75
0.50
0.4
0.3
v
w
y
Z (1) θ
0.2 0.13 0.1
0.72
0.38
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
95-04-04
99-12-27
2002 Nov 18
11