MCP6546/6R/6U/7/8/9
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
5-Lead SC-70 (MCP6546)
Example: (I-temp)
XXNN (Front)
YWW (Back)
Device
I-Temp
Code
E-Temp
Code
MCP6546
ACNN
Note 2
Note 1: I-Temp parts prior to March
2005 are marked “ACN”
2: SC-70-5 E-Temp parts not
available at this release of
the data sheet.
AC25(Front)
636 (Back)
5-Lead SOT-23 (MCP6546, MCP6546R, MCP6546U)
Example: (I-temp)
XXNN
Device
I-Temp
Code
E-Temp
Code
MCP6546
ACNN
GWNN
MCP6546R
MCP6546U
AHNN
—
GXNN
AWNN
Note: Applies to 5-Lead SOT-23
8-Lead PDIP (300 mil)
AC25
Example:
XXXXXXXX
XXXXXNNN
YYWW
MCP6546
I/P256
OR
0636
MCP6546
I/P^e3^256
0636
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
NNN
Example:
MCP6546
I/SN0636
256
MCP6546I
OR SN^e^3 0636
256
8-Lead MSOP
XXXXXX
YWWNNN
Example:
6546I
636256
Legend:
XX...X
Y
YY
WW
NNN
e3
*
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2006 Microchip Technology Inc.
DS21714E-page 17