Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Gate leakage current
Gate−source breakdown voltage
Drain cut−off current
Drain−source breakdown voltage
Gate threshold voltage
Drain−source ON resistance
Forward transfer admittance
Input capacitance
Reverse transfer capacitance
Output capacitance
IGSS
V (BR) GSS
IDSS
I (BR) DSS
Vth
RDS (ON)
|Yfs|
Ciss
Crss
Coss
VGS = ±25 V, VDS = 0 V
IG = ±10 μA, VDS = 0 V
VDS = 500 V, VGS = 0 V
ID = 10 mA, VGS = 0 V
VDS = 10 V, ID = 1 mA
VGS = 10 V, ID = 5 A,
VDS = 10 V, ID = 5 A
VDS = 10 V, VGS = 0 V, f = 1 MHz
Rise time
tr
Turn−on time
ton
Switching time
Fall time
tf
Turn−off time
toff
Total gate charge (gate−source
plus gate−drain)
Qg
Gate−source charge
Qgs
VDD ≈ 400 V, VGS = 10 V, ID = 10 A
Gate−drain (“miller”) Charge
Qgd
Source−Drain Ratings and Characteristics (Ta = 25°C)
Characteristics
Continuous drain reverse current
(Note 1)
Pulse drain reverse current
(Note 1)
Forward voltage (diode)
Reverse recovery time
Reverse recovery charge
Symbol
IDR
IDRP
VDSF
trr
Qrr
Test Condition
—
—
IDR = 10 A, VGS = 0 V
IDR = 10 A, VGS = 0 V
dIDR / dt = 100 A / μs
Marking
2SK2601
Min Typ. Max Unit
—
—
±10
μA
±30 —
—
V
—
—
100
μA
500
—
—
V
2.0
—
4.0
V
— 0.75 1.0
Ω
3.5 7.0
—
S
— 1200 —
— 200 —
pF
— 550 —
—
30
—
—
50
—
ns
—
45
—
— 180 —
—
30
—
—
15
—
nC
—
15
—
Min Typ. Max Unit
—
—
10
A
—
—
40
A
—
—
−1.7
V
— 1200 —
ns
—
10
—
μC
TOSHIBA
K2601
Part No. (or abbreviation code)
Lot No.
A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.
2
2006-11-02