White Electronic Designs
Document Title
128MB – 16Mx72 DDR SDRAM UNBUFFERED
DRAM DIE OPTIONS:
• SAMSUNG: H-Die
• MICRON: T26Z: G-Die
Revision History
Rev #
Rev A
Rev 0
History
Created Datasheet
0.1 Updated IDD and CAP specs
0.2 Updated AC specs
0.3 Moved from Advanced to Preliminary
0.4 Added Lead-Free and RoHS note
Rev 1
Rev 2
1.0 Added JEDEC PCB option (JD3)
1.1 D3 PCB option "NOT RECOMMENDED FOR NEW
DESIGNS"
2.1 Removed "D3" package option
2.2 Added "Part Numbering Guide"
2.3 Added DRAM die options
2.4 Added DDR400 and DDR333 ICC & AC specifications
WED3EG7218S-JD3
PRELIMINARY
Release Date Status
3-6-02
Advanced
11-04
Preliminary
11-05
6-06
Preliminary
Preliminary
June 2006
Rev. 2
12
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com