TMP87C408LM 데이터 시트보기 (PDF) - Toshiba

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TMP87C408LM

Quality And Reliability Assurance / Handling Precautions

Toshiba 

Quality and Reliability Assurance / Handling Precautions

4.5.3

Soldering Temperature Profile

The soldering temperature and heating time vary from device to device.

Therefore, when specifying the mounting conditions, refer to the individual

datasheets and databooks for the devices used.

(1) Using a Soldering Iron

Complete soldering within ten seconds for lead temperatures of up to

260°C, or within three seconds for lead temperatures up to 350°C.

(2) Standard Mounting Conditions for SMDs

(Surface Mount Devices)

For details, refer to section 2.1 Mounting Precautions in chapter 2

Handling Precautions for Microcontrollers.

030901

QUA-43

2002-02-20

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