MAX15004A 데이터 시트보기 (PDF) - Maxim Integrated

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MAX15004A

4.5V to 40V Input Automotive Flyback/Boost/SEPIC Power-Supply Controllers

Maxim Integrated 

MAX15004A/B-MAX15005A/B

Layout Recommendations

Typically, there are two sources of noise emission in a

switching power supply: high di/dt loops and high dv/dt

surfaces. For example, traces that carry the drain current

often form high di/dt loops. Similarly, the heatsink of the

MOSFET connected to the device drain presents a dv/dt

source; therefore, minimize the surface area of the heat-

sink as much as possible. Keep all PCB traces carrying

switching currents as short as possible to minimize cur-

rent loops. Use a ground plane for best results.

Careful PCB layout is critical to achieve low switch-

ing losses and clean, stable operation. Refer to the

MAX15005 EV kit data sheet for a specific layout exam-

ple. Use a multilayer board whenever possible for better

noise immunity. Follow these guidelines for good PCB

layout:

1) Use a large copper plane under the package and

solder it to the exposed pad. To effectively use this

copper area as a heat exchanger between the PCB

and ambient, expose this copper area on the top and

bottom side of the PCB.

2) Do not connect the connection from SGND (pin

7) to the EP copper plane underneath the IC. Use

midlayer-1 as an SGND plane when using a multilayer

board.

4.5V to 40V Input Automotive

Flyback/Boost/SEPIC

Power-Supply Controllers

3) Isolate the power components and high-current path

from the sensitive analog circuitry.

4) Keep the high-current paths short, especially at the

ground terminals. This practice is essential for stable,

jitter-free operation.

5) Connect SGND and PGND together close to the

device at the return terminal of VCC bypass capacitor.

Do not connect them together anywhere else.

6) Keep the power traces and load connections short.

This practice is essential for high efficiency. Use

thick copper PCBs (2oz vs. 1oz) to enhance full-load

efficiency.

7) Ensure that the feedback connection to FB is short and

direct.

8) Route high-speed switching nodes away from the

sensitive analog areas. Use an internal PCB layer for

SGND as an EMI shield to keep radiated noise away

from the device, feedback dividers, and analog bypass

capacitors.

9) Connect SYNC pin to SGND when not used.

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