MAX11608 데이터 시트보기 (PDF) - Maxim Integrated

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MAX11608

Low-Power, 4-/8-/12-Channel, I2C, 10-Bit ADCs in Ultra-Small Packages

Maxim Integrated 

MAX11606–MAX11611

Low-Power, 4-/8-/12-Channel, I2C,

10-Bit ADCs in Ultra-Small Packages

ABSOLUTE MAXIMUM RATINGS

VDD to GND ..............................................................-0.3V to +6V

AIN0–AIN11,

REF to GND ............-0.3V to the lower of (VDD + 0.3V) and 6V

SDA, SCL to GND.....................................................-0.3V to +6V

Maximum Current into Any Pin .........................................±50mA

Continuous Power Dissipation (TA = +70°C)

8-Pin µMAX (derate 5.9mW/°C above +70°C) ..........470.6mW

12-Pin WLP (derate 16.1mW/°C above +70°C) .........1288mW

16-Pin QSOP (derate 8.3mW/°C above +70°C)........666.7mW

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-60°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

(VDD = 2.7V to 3.6V (MAX11607/MAX11609/MAX11611), VDD = 4.5V to 5.5V (MAX11606/MAX11608/MAX11610), VREF = 2.048V

(MAX11607/MAX11609/MAX11611), VREF = 4.096V (MAX11606/MAX11608/MAX11610), fSCL = 1.7MHz, TA = TMIN to TMAX, unless other-

wise noted. Typical values are at TA = +25°C. See Tables 1–5 for programming notation.) (Note 1)

PARAMETER

DC ACCURACY (Note 2)

Resolution

Relative Accuracy

Differential Nonlinearity

Offset Error

SYMBOL

CONDITIONS

INL

DNL

(Note 3)

No missing codes over temperature

MIN TYP MAX UNITS

10

Bits

±1

LSB

±1

LSB

±1

LSB

Offset-Error Temperature

Coefficient

Gain Error

Gain-Temperature Coefficient

Channel-to-Channel Offset

Matching

Relative to FSR

(Note 4)

Relative to FSR

0.3

ppm/°C

±1

LSB

0.3

ppm/°C

±0.1

LSB

Channel-to-Channel Gain

Matching

±0.1

LSB

DYNAMIC PERFORMANCE (fIN(SINE-WAVE) = 10kHz, VIN(P-P) = VREF, fSAMPLE = 94.4ksps)

Signal-to-Noise Plus Distortion

SINAD

60

dB

Total Harmonic Distortion

THD Up to the 5th harmonic

-70

dB

Spurious Free Dynamic Range

SFDR

70

dB

Full-Power Bandwidth

SINAD > 57dB

3.0

MHz

Full-Linear Bandwidth

-3dB point

5.0

MHz

CONVERSION RATE

Conversion Time (Note 5)

tCONV

Internal clock

External clock

6.8

µs

10.6

Internal clock, SCAN[1:0] = 01

53

Throughput Rate

fSAMPLE

Internal clock, SCAN[1:0] = 00

CS[3:0] = 1011 (MAX11610/MAX11611)

53

ksps

Track/Hold Acquisition Time

External clock

94.4

800

ns

2

Maxim Integrated

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