HCTS132DMSR 데이터 시트보기 (PDF) - Intersil

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HCTS132DMSR

Radiation Hardened Quad 2-Input NAND Schmitt Trigger

Intersil 

Die Characteristics

DIE DIMENSIONS:

90 x 90 mils

2.29 x 2.29mm

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 x 4 mils

Metallization Mask Layout

B1

(2)

HCTS132MS

HCTS132MS

A1

VCC

B4

(1)

(14)

(13)

Y1 (3)

A2 (4)

B2 (5)

NC

NC

(12) A4

(11) Y4

(10) B3

(6)

(7)

Y2

GND

(8)

(9)

Y3

A3

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS132 is TA14483A.

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