SB820 데이터 시트보기 (PDF) - Micro Electro Magnetical Tech

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SB820

SCHOTTKY DIE SPECIFICATION

Micro Electro Magnetical Tech 

Micro-Electro-Magnetical Tech Co.

SCHOTTKY DIE SPECIFICATION

General Description: 20 V 8 A Standard VF

TYPE: SB820

Single Anode

ELECTRICAL CHARACTERISTICS

DC Blocking Voltage: Ir=1mA(for wafer form)

Ir=0.5mA (for dice form)

Average Rectified Forward Current

Maximum Instantaneous Forward Voltage

@ 8 Amperes,Ta= 25°C

SYM

VRRM

IFAV

VF MAX

Spec. Limit

20

8

0.5

Maximum Instantaneous Reverse Voltage

VR= 20 Volt, Ta=25°C

IR MAX

0.3

Maximum Junction Capacitance@ 0V, 1MHZ

MAXIMUM RATINGS

Nonrepetitive Peak Surge Current

Operating Junction Temperature

Storage Temperatures

Cj MAX

IFSM

Tj

TSTG

225

-65 to +125

-65 to +125

Specification apply to die only. Actual performance may degrade when assembled.

MEMT does not guarantee device performance after assembly.

Data sheet information is subjected to change without notice.

DICE OUTLINE DRAWING

Die Sort UNIT

22.5 Volt

Amp

0.49 Volt

0.25 mA

pF

Amp

°C

°C

DIM

ITEM

um2

Mil2

A Die Size

2220 87.40

A

C

B Top Metal Pad Size

C Passivation Seal

2120 83.5

2140 84.3

D Thickness (Min)

254

10

Thickness (Max)

305

12

B

Top-side Metal

SiO2 Passivation

PS:

(1)Cutting street width is around 80um(3.14mil).

(2)Both of top-side and back-side metals are Ti/Ni/Ag.

D

P+ Guard Ring

Back-side Metal

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