
Package Outline
Unit: mm
24PIN SSOP (PLASTIC) 275mil
∗7.8 ± 0.1
24
13
+ 0.2
1.25 – 0.1
0.10
A
0.1 ± 0.1
1
+ 0.1
0.22 – 0.05
12
0.65
±
0.120.15
+
–
0.05
0.02
0° to 10°
DETAIL A
CXA3001N
NOTE : ∗NOT INCLUDE MOLD FINS.
SONY CODE
EIAJ CODE
JEDEC CODE
SSOP-24P-L01
A SIMILAR TO SSOP024-P-0300
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY / PHENOL RESIN
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
SOLDER PLATING
42 ALLOY
– 12 –