CD4017BMS 데이터 시트보기 (PDF) - Intersil

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CD4017BMS

CMOS Counter/Dividers

Intersil 

CD4017BMS, CD4022BMS

Chip Dimensions and Pad Layouts

CD4017BMSH

Dimensions in parentheses are in millimeters

and are derived from the basic inch dimensions

as indicated. Grid graduations are in mils (10-3 inch)

CD4022BMSH

METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.

PASSIVATION: 10.4kÅ - 15.6kÅ, Silane

BOND PADS: 0.004 inches X 0.004 inches MIN

DIE THICKNESS: 0.0198 inches - 0.0218

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