Freescale Semiconductor, Inc.
Packaging
A
-P-
16
L
PIN 1
IDENTIFICATION
1
C
0.100 (0.004) M
-T- SEATING
PLANE
DG
K
K1
J1
16x K REF
0.200 (0.008) M T
9
B
8
H
A
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSIONS A AND B ARE TO BE DETERMINED
AT DATUM PLANE -U-.
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A
--- 5.10
--- 0.200
B 4.30 4.50 0.169 0.177
-U-
C
--- 1.20
--- 0047
D 0.05 0.25 0.002 0.010
F 0.45 0.55 0.018 0.022
G
0.65 BSC
0.026 BSC
H 0.22 0.23 0.009 0.010
J 0.09 0.24 0.004 0.009
J1 0.09 0.18 0.004 0.007
K 0.16 0.32 0.006 0.013
K1 0.16 0.26 0.006 0.010
L 6.30 6.50 0.248 0.256
M
05
105
05
105
J
A
SECTION A-A
F
Figure 37. Outline Dimensions for DT Suffix, TSSOP-16
(Case 948C-03, Issue B)
MOTOROLA
MC145170-2 Technical Data
31
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