Brief Description
The ZSSC3018 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of differential or pseudo-differential input signals. Designed for high-resolution sensor module applications, the ZSSC3018 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge or absolute voltage sensors, it can also provide a corrected temperature output measured with an internal sensor.

FEATUREs
◾ Flexible, programmable analog front-end design; up to 18-bit
   analog-to-digital converter (ADC)
◾ Fully programmable gain amplifier with gain range from 6.6 to
   216 (linear)
◾ Internal auto-compensated temperature sensor
◾ Digital compensation of individual sensor offset; 1st and 2nd
   order digital compensation of sensor gain as well as of 1st
   and 2nd order temperature gain and offset drift
◾ Programmable interrupt operation
◾ High-speed sensing: e.g., 16-bit conditioned sensor signal
   measurement rate >500s-1
◾ Typical sensor system can achieve an accuracy of better than
   ±0.10% FSO* @ -40 to 125°C

Benefits
◾ Integrated 26-bit calibration math DSP
◾ Fully corrected signal at digital output
◾ Layout customized for die-die bonding with sensor for highdensity chip-on-board assembly
◾ One-pass calibration minimizes calibration costs
◾ No external trimming, filter, or buffering components required
◾ Highly integrated CMOS design
◾ Integrated reprogrammable non-volatile memory
◾ Excellent for low-voltage and low-power battery applications
◾ Optimized for operation in calibrated resistive sensor
   (e.g., pressure) or calibrated absolute voltage sensor
   (e.g., thermopile) modules

APPLICATIONs
◾ Barometric altitude measurement for portable
   navigation or emergency call systems
◾ Altitude measurement for car navigation
◾ Weather forecast
◾ Fan control
◾ Industrial, pneumatic, and liquid pressure
◾ High-resolution temperature measurements
◾ Object-temperature radiation (via thermopile)