Product Description
The WLP200 consists of 6 RC filters with different filter characteristics in a wafer level package (WLP). All I/O pins are ESD protected for contact discharges up to 8KV per the IEC1000-4-2 level 4 specification. Two versions with different capacitor values are available. Cellular phone application frequently demands filtering of signals in the 800 to 2,700 MHz band. California Micro Devices’ unique thin film Flip Chip filters provide a minimum of –30 dB of attenuation over this frequency band. The bump size and pitch of these filters are selected such that the device can be placed directly on a FR4 printed circuit board using conventional assembly techniques. Ground-bounce and cross-talk are minimized by a die design that provides eight solder bump contacts to the common supply connection. The solder bump contacts are a 63/37 Sn/Pb alloy and are nominally 0.30 mm in diameter.

FEATUREs
• 6 Filters per device
• Ultra small footprint, 0.5mm pitch
• Silicon substrate
• 0.30mm Eutectic Solder Bumps

APPLICATIONs
• EMI filter for Mobile Equipment (e.g. Cellular Phones)
• Evaluation Device