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TB6S-15 PDF
TB6S-15 データシート - Dongguan Pingjingsemi Technology Co., Ltd,
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Dongguan Pingjingsemi Technology Co., Ltd,
FEATURES
✦ For surface mount applications
✦ Glass passivated chip junction
✦ High surge current capability
✦ Lead free in comply with EU RoHS2011/65/EU directives
MECHANICAL DATA
✦ Case: ABS/LBF molded plastic body
✦ Terminals: Solderable per MIL-STD-750, Method 2026
✦ Weight: Approximated 0.088 grams