Features
• 150 °C TJ operation
• Center tap configuration
• Ultralow forward voltage drop
• High purity, high temperature epoxy encapsulation for
   enhanced mechanical strength and moisture resistance
• High frequency operation
• Guard ring for enhanced ruggedness and long term
   reliability
• Trench MOS Schottky technology
• This is a Pb − Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request

APPLICATIONs
• Switching power supply
• Converters
• Free-Wheeling diodes
• Reverse battery protection