FEATURES
• Low profile package
• Ideal for automated placement
• Glass passivated chip junction
• Low Zener impedance
• Low regulation factor
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS
   For general purpose regulation and protection applications.