FEATURES
● LOW PROFILE PACKAGE
● PLASTIC PACKAGE HAS UNDERWRITERS LABORATORY 94V-0
● IDEAL FOR SURFACE MOUNTED APPLICATION
● GLASS PASSIVATED CHIP JUNCTION
● BUILT-IN STRAIN RELIEF DESIGN
● SUPER FAST RECOVERY TIME FOR HIGH EFFICIENT
● HIGH TEMPERATURE SOLDERING : 250°C/10 SECONDS AT TERMINAL

MECHANICAL DATA
● CASE: JEDEC DO-214AA MOLDED PLAS BODY, DIMENSIONS IN INCHES AND (MILLIMETERS)
● TERMINAL: SOLDER PLATED, SOLDERABLE PER MIL-STD-750 METHOD 2026
● POLARITY: COLOR BAND DENOTES CATHODE
● WEIGHT: 0.21 GRAMS