Features
• Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to optimize board space..
• Tiny plastic SMD package.
• High current capability.
• High surge current capability.
• Glass passivated chip junction.
• Lead-free parts meet RoHS requirments.
• Super fast reovery time for switching mode application.
• Suffix "-H" indicates Halogen free parts, ex. SFM11-MH1-H.