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RS1 データシート - Philips Electronics
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Philips Electronics
DESCRIPTION
DO-214AC surface mountable package with glass passivated chip.
The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J bent leads.
FEATURES
• Glass passivated
• High maximum operating temperature
• Ideal for surface mount automotive applications
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• UL 94V-O classified plastic package
• Shipped in 12 mm embossed tape
• Marking: cathode, date code, type code
• Easy pick and place.
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