
C and D TECHNOLOGIES
DESCRIPTION
The NTV series of 3kV isolation miniature surface mounted DC-DC Converters employ leadframe technology and transfer moulding techniques to bring all of the benefits of IC style packaging to hybrid circuitry. The devices are fully compatible with CECC00802 to 280°C which allows them to be placed and reflowed with IC’s, thus reducing time and cost in production. The coplanarity of the pin positions is based upon IEC 191-6:1990. The devices are suitable for all applications where high volume production is envisaged.
FEATURES
■ 3kVDC Isolation (1 Minute)
■ Wide Temperature Performance at Full 1 Watt Load, -40°C to 85°C
■ Lead Frame Technology
■ CECC00802 Reflow (280°C)
■ Dual Isolated Output
■ Efficiency to 82%
■ Power Density 1.5W/cm3
■ 5V & 12V Input
■ 5V, 9V, 12V and 15V Output
■ Footprint Over Pins 1.64cm2
■ UL 94V-0 Package Material
■ No Heatsink Required
■ Internal SMD Construction
■ Toroidal Magnetics
■ Plastic Encapsulated
■ MTTF up to 2.1 Million Hours
■ Custom Solutions Available
■ Multi Layer Ceramic Capacitors
■ Lead Free Compatibility
■ Tape and Reel Option