部品番号
NEXM224Z5.5V10.5X6.5TBF
コンポーネント説明
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1 Pages
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65.5 kB
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NIC-Components Corp.
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NEXM224Z5.5V10.5X6.5TBF データシート - NIC-Components Corp.
NIC-Components Corp.
FEATURES
• DOUBLE LAYER CONSTRUCTION
• POWER BACK-UP FOR CMOS RAM
(UP TO 50μA DISCHARGE CURRENT)
• TAPE AND BOX PACKAGING
• SUITABLE FOR FLOW SOLDERING
• LEAD-FREE FINISH
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