3M™Three-Wall Condo Header .100 × .100 Right Angle

• Stacked pins conserve space on the circuit board allowing
   higher density packaging
• Pin quantity to 128 gives design flexibility with latching
• “HDI’’ alternative
• Three-wall fits in VME board stacking criteria
• Accepts standard IDC sockets
• Mates with standard flat cable harnesses
• Optional high temperature insulator suitable for “no lead”
   soldering operations
• High temperature option suitable for reflow soldering using
   “paste in hole” techniques
• RoHS Compliant. See the Regulatory Information
   Appendix (RIA) in the “RoHS compliance” section of
   www.3Mconnectors.com for compliance information
   (RIA E1 & C1 apply)