DESCRIPTION
   The MEMSIC Three-Axis Thermal Accelerometer is based on MEMSIC’s Proprietary thermal technology that is built with 0.18µm standard CMOS process and the most advanced Wafer Level Packaging. This device contains no moving sensor parts and thus eliminates field reliability and repeatability issues associated with competitive products. For example, there is no measurable resonance (immunity to vibration), no stiction, and no detectable hysteresis. It also eliminates the "click" sounds typically heard in ball based orientation sensors. Shock survival of the MEMS sensing structure is greater than 200,000g.

FEATURES
• Ultra Low Cost
• Most Advantaged Technology in Industry
• Monolithically-Integrated Single Chip MEMS
   Sensor with On-Chip Signal Processing
• MEMSIC Proprietary Technology with No
   Moving Parts
• >200,000g Shock Survival Rating of Sensing
   Structure
• 12-bit Signal Output for X, Y and Z Axes
• Full Scale Range ±2g, ±4g and ±8g
• 8-bit Temperature Output (-50°C to +100°C)
• Smallest Wafer Level Package (WLP) Footprint
   1.18mm×1.70mm×0.85mm
• 6-Position Orientation Detection
• Shake Detection with Interrupt
• Programmable Shake Detection Threshold
• I2C Slave, FAST (≤400 KHz) Mode Interface
• 1.8~3.6V Single Supply Continuous Operation
• 1.8V Compatible I/O
• Embedded Power Up/Down Mode
• Eight I2C Addresses Pre-settable by User
• RoHS Compliant

APPLICATIONS
• Information Appliances – Cell Phones, Tablets,
   PDA’s, Computer Peripherals
• Consumer – LCD Projectors, Pedometers,
   DSC/DVC, MP3/MP4
• Gaming – Joystick, Toys
• Household Safety – Heating Fan, Iron, Cooling
   Fan