FEATURES
• Integrally molded heatsinks provide very low thermal
   resistance for maximum heat dissipation.
• surge overload rating to 500 amperes.
• High temperature soldering guaranteed:
   260°C/10 second, at 5 lbs tension.

MECHANICAL DATA
• Case: Epozy, Molded plastic with heatsink integrally
   mounted in the bridge encapsulation.
• Mounting Position: Bolt down on heatsink with silicon
   thermal compound between bridge and mounting
   surface for maximum heat transfer efficiency.
• Mounting Torque: 20 in. lbs max.
• Weight: 0.706 ounce, 20 gram