HiPerFET™ Power MOSFET   
Single Die MOSFET

Features
• International standard packages
• Encapsulating epoxy meets
    UL 94 V-0, flammability classification
• miniBLOC with Aluminium nitride
    isolation
• Low RDS (on) HDMOSTM process
• Rugged polysilicon gate cell structure
• Unclamped Inductive Switching (UIS)
    rated
• Low package inductance
• Fast intrinsic Rectifier
   
Advantages
• PLUS247 package for clip or spring
    bar mounting
• Easy to mount
• Space savings
• High power density