Features
● Silicon Chip on Direct-Copper Bond (DCB) Substrate
● Isolated Mounting Surface
● 3000V~ Electrical Isolation
● High Blocking Voltage
● High Peak Current Capability
● Low Saturation Voltage
● FBSOA Rated
● SCSOA Rated

Advantages
● Low Gate Drive Requirement
● High Power Density

APPLICATIONs
● Laser Generators
● Capacitor Discharge Circuits
● AC Switches
● Protection Circuits