Description
   The SOP-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements. multiple devices can be used in an application with dramatically reducea board space. The package is designed for vapor phase, infra red, or wave soldering technigues.

FEATUREs
N-Ch:
● VDS (V) = 30V
● RDS(ON) < 31mΩ (VGS = 10V)
● RDS(ON) < 48mΩ (VGS = 4.5V)

P-Ch:
● VDS (V) = -30V
● RDS(ON) < 60mΩ (VGS =-10V)
● RDS(ON) < 100mΩ (VGS = -4.5V)
● Generation V Technology
● Ultra Low On-Resistance
● Dual N and P Channel MOSFET
● Surface Mount
● Fully Avalanche Rated
● Lead-Free