FRA1601G データシート - TSC Corporation
メーカー

TSC Corporation
Features
◇ Glass passivated chip junction.
◇ High efficiency, Low VF
◇ High current capability
◇ High reliability
◇ High surge current capability
◇ Low power loss
◇ Green compound with suffix "G" on packing
code & prefix "G" on datecode
Mechanical Data
◇ Cases: TO-220AC Molded plastic
◇ Epoxy: UL 94V-0 rate flame retardant
◇ Terminals: Pure tin plated, Lead free. Leads
solderable per MIL-STD-202, Method 208
guaranteed
◇ Polarity: As marked
◇ High temperature soldering guaranteed:
260 °C /10 seconds, 0.16”,(4.06mm) from
case.
◇ Mounting position: Any
◇ Weight: 2.24 grams
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