EGL34G データシート - General Semiconductor
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General Semiconductor
FEATURES
♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0
♦ Capable of meeting environmental standards of MIL-S-19500
♦ For surface mount applications
♦ High temperature metallurgically bonded construction
♦ Glass passivated cavity-free junction
♦ Fast switching for high efficiency
♦ High temperature soldering guaranteed: 450°C/5 seconds at terminals. Complete device submersible temperature of 260°C for 10 seconds in solder bath
SURFACE MOUNT GLASS PASSIVATED JUNCTION FAST EFFICIENT RECTIFIER
General Semiconductor
SURFACE MOUNT GLASS PASSIVATED JUNCTION FAST EFFICIENT RECTIFIER
General Semiconductor
SURFACE MOUNT GLASS PASSIVATED JUNCTION FAST EFFICIENT RECTIFIER
General Semiconductor
SURFACE MOUNT GLASS PASSIVATED JUNCTION ULTRAFAST EFFICIENT RECTIFIER
ZOWIE Technology
SURFACE MOUNT GLASS PASSIVATED JUNCTION HIGH EFFICIENT RECTIFIER
ZOWIE Technology
SURFACE MOUNT GLASS PASSIVATED JUNCTION ULTRAFAST EFFICIENT RECTIFIER
ZOWIE Technology
SURFACE MOUNT GLASS PASSIVATED JUNCTION ULTRAFAST EFFICIENT RECTIFIER
ZOWIE Technology
SURFACE MOUNT GLASS PASSIVATED JUNCTION HIGH EFFICIENT RECTIFIER
ZOWIE Technology
SURFACE MOUNT GLASS PASSIVATED JUNCTION ULTRAFAST EFFICIENT RECTIFIER
ZOWIE Technology
SURFACE MOUNT GLASS PASSIVATED JUNCTION HIGH EFFICIENT RECTIFIER
ZOWIE Technology