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CP741V-CMPT7410
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CP741V-CMPT7410 データシート - Central Semiconductor
Central Semiconductor
The CP741V-CMPT7410 die is a low VCE(SAT) silicon PNP transistor designed for high current applications.
MECHANICAL SPECIFICATIONS:
Die Size 17.7 x 17.7 MILS
Die Thickness 7.1 MILS
Base Bonding Pad Size 3.8 x 3.8 MILS
Emitter Bonding Pad Size 3.8 x 3.8 MILS
Top Side Metalization Al-Si – 30,000Å
Back Side Metalization Au – 9,000Å
Scribe Alley Width 1.97 MILS
Wafer Diameter 5 INCHES
Gross Die Per Wafer 54,330
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