部品番号
CP394R
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Central Semiconductor
CP394R データシート - Central Semiconductor
Central Semiconductor
PROCESS DETAILS
Die Size 15.7 x 15.7 MILS
Die Thickness 3.9 MILS
Gate Bonding Pad Area 3.9 x 3.9 MILS
Source Bonding Pad Area 9.1 x 8.1 MILS
Top Side Metalization Al-Si - 35,000Å
Back Side Metalization Au - 12,000Å
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