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BYV28-100 データシート - Philips Electronics

BYV28 image

部品番号
BYV28-100

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page
16 Pages

File Size
99.1 kB

メーカー
Philips
Philips Electronics 

DESCRIPTION
Rugged glass SOD64 package, using a high temperature alloyed construction.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.


FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack
• Also available with preformed leads for easy insertion.

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