BYD17 データシート - Philips Electronics
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Philips Electronics
DESCRIPTION
Cavity free cylindrical glass package through Implotec(1) technology.
This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy
absorption capability
• Shipped in 8 mm embossed tape
• Smallest surface mount rectifier
outline.
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