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BY527 データシート - New Jersey Semiconductor

BY527 image

部品番号
BY527

コンポーネント説明

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page
2 Pages

File Size
86.4 kB

メーカー
NJSEMI
New Jersey Semiconductor 

DESCRIPTION
Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.


FEATURES
• Glass passivated
• High maximum operating temperature
• Lowleakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• Available in ammo-pack.

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