Product Description
BeRex’s Divider BD23B is designed for PCS, WCDMA & TD-SCDMA and WiBro band with low Insertion Loss and Isolation. This chip is fully passivated for enhanced performance and reliability and packaged in RoHS-compliant with SOIC-8 surface mount package. It can be used without back side ground soldering. (This may degrade the performance at the high frequency edge.)

Device Features
• Typical Isolation = 25 dB
• Typical Insertion Loss = 0.4 dB
• MSL 3 moisture rating
• Lead-free/RoHS-compliant SOIC-8 Plastic Package
   With exposed back side ground pad

APPLICATIONs
• Base station Infrastructure
• Commercial/Industrial/Military wireless system