General description
PNP medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.

FEATUREs and benefits
■ High collector current capability IC and ICM
■ Three current gain selections
■ Reduced Printed-Circuit Board (PCB) area requirements
■ Leadless very small SMD plastic package with medium power capability
■ Exposed heat sink for excellent thermal and electrical conductivity
■ Suitable for Automatic Optical Inspection (AOI) of solder joint
■ AEC-Q101 qualified

APPLICATIONs
■ Linear voltage regulators 
■ High-side switches
■ Battery driven devices 
■ Power management
■ MOSFET drivers 
■ Amplifiers