Product Features
■ IEEE 802.3ab compliant
   —Robust operation over the installed base
      of Category-5 (Cat-5) twisted pair
      cabling
■ Robust end to end connections over various
   cable lengths
■ Full duplex at 10, 100, or 1000 Mbps and
   half duplex at 10 or 100 Mbps.
■ IEEE 802.3ab Auto-negotiation with Next
   Page support
   —Automatic link configuration including
      speed, duplex, and flow control
■ 10/100 downshift
   —Automatic link speed adjustment with
      poor quality cable
■ Automatic MDI crossover
   —Helps to correct for infrastructure issues
■ Advanced Cable Diagnostics
   —Improved end-user troubleshooting
■ Footprint compatible with 82562V devices
   for a single-board dual design (Gigabit and
   10/100)
■ LCI interface for a very low power 10/100
   link
■ Gigabit LAN Connect Interface
   —Low pin count, high speed interface
      with special low power idle modes
   —Allows PHY placement proximity to I/O
      back panel.
■ 3 LED outputs
   —Link and Activity indications (10, 100,
      and 1000 Mbps)
■ Clock supplied to MAC
   —Cost optimized design
■ Full chip power down
   —Support for lowest power state
■ 81-pin, 1.0 mm pitch, 10 mm x 10 mm
   FCMMAP (BGA) Package
   —Smaller footprint and lower power
      dissipation compared to multi-chip
      MAC and PHY solutions. Footprint
      compatible with the Intel® 82562V
      Platform LAN Connect device
■ Integrated voltage regulator and power
   supply control, which can be powered from
   a single 3.3V DC rail
■ Operating temperatures: 0° C to 70° C and
   0° C to 55° C (with internal regulator) –
   heat sink or forced airflow not required
   —Simple Thermal Design
■ Power Consumption less than 1.16 Watts
   (silicon power)