Fair-Rite offers a broad selection of cost effective multi-layer chip beads to suppress conducted EMI signals. Chip beads can be used in an array of devices such as cellular phones, computers, laptops, pagers, etc. The small package sizes accommodate automated placements and allow for a dense packaging of circuit boards. Chip beads are 100% tested for impedance and dc resistance. They are available in standard, high and GHz signal speeds. The multi-layer chip beads are organized by increasing package size and current carrying capacity.

Description: MULTI-LAYER CHIP BEAD

APPLICATION: Suppression Components