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ADUCM410BBCZ-RL7(Rev0) データシートの表示(PDF) - Analog Devices

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ADUCM410BBCZ-RL7 Datasheet PDF : 35 Pages
First Prev 31 32 33 34 35
Data Sheet
ADuCM410
ORDERING GUIDE
Model1, 2
ADuCM410BBCZ
ADuCM410BBCZ-RL7
ADuCM410BCBZ-RL7
EVAL-ADUCM410QSPZ
EVAL-ADUCM410QSP1Z
Temperature Range
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
Package Description
81-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
81-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
64-Ball Wafer Level Chip Scale Package [WLCSP]
BGA Evaluation Board and Quick Start Development System
WLCSP Evaluation Board and Quick Start Development System
1 Z = RoHS Compliant Part.
2 CSP_BGA package uses ultralow alpha (ULA) molding compounds.
Package Option
BC-81-6
BC-81-6
CB-64-2
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2020 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D20321-9/20(0)
Rev. 0 | Page 35 of 35

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