NCP161
PACKAGE DIMENSIONS
XDFN4 1.0x1.0, 0.65P
CASE 711AJ
ISSUE O
D
A
B
4X L2
PIN ONE
REFERENCE
ÉÉÉÉ 2X
0.05 C
E
2X
0.05 C
TOP VIEW
4X b2
DETAIL A
0.05 C
0.05 C
NOTE 4
SIDE VIEW
(A3)
A
A1
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM THE TERMINAL TIPS.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.33 0.43
A1 0.00 0.05
A3 0.10 REF
b 0.15 0.25
b2 0.02 0.12
D 1.00 BSC
D2 0.43 0.53
E 1.00 BSC
e 0.65 BSC
L 0.20 0.30
L2 0.07 0.17
e
DETAIL A
1
e/2
4X L
2
D2
45 5
D2
4
3
4X b
0.05 M
BOTTOM VIEW
CA B
NOTE 3
RECOMMENDED
MOUNTING FOOTPRINT*
0.65
PITCH
PACKAGE
OUTLINE
4X 0.11
2X
0.52
4X
0.39 1.20
4X
0.24
4X
0.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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