
PACKAGE OUTLINE DIMENSIONS
DO-214AA (SMB)
ES3AB - ES3JB
Taiwan Semiconductor
DIM.
A
B
C
D
E
F
G
H
Unit (mm)
Min Max
1.95 2.20
4.05 4.60
3.30 3.95
1.95 2.65
0.75 1.60
5.10 5.60
0.05 0.20
0.15 0.31
Unit (inch)
Min Max
0.077 0.087
0.159 0.181
0.130 0.156
0.077 0.104
0.030 0.063
0.201 0.220
0.002 0.008
0.006 0.012
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
Symbol
A
B
C
D
E
Unit (mm)
2.3
2.5
4.3
1.8
6.8
Unit (inch)
0.091
0.098
0.169
0.071
0.268
P/N = Marking Code
G
= Green Compound
YW = Date Code
F
= Factory Code
7
Version:B1706