Surface Mount Transient Voltage Suppressors
试验脉冲 5a
SYSTEM
12V
24V
TEST
LEVEL
Ⅳ
Ⅳ
Us(V)
87
174
Td(ms) Ri(Ω )
400
2
200
4
NUMBER OF
PULSE
10 pulse
10 pulse
Soldering Parameters
TP
TL
TS(max)
Ramp-up
TS(min)
25
Preheat
Time to peak temperature
(t 25℃ to peak)
Critical Zone
TL to TP
Ramp-down
Time
Reflow Condition
Lead–free assembly
Pre Heat
-Temperature Min (Ts(min))
-Temperature Max (Ts(max))
150°C
200°C
- Time (min to max) (ts)
Average ramp up rate ( Liquidus Temp TL)
to peak
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
- Time (min to max) (ts)
Peak Temperature (TP)
Time within 5°C of
Temperature (tp)
actual
peak
Ramp-down Rate
60 -180 Seconds
3°C/second max
3°C/second max
217°C
60 -150 Seconds
260 +0/-5°C
20 -40 Seconds
6°C/second max
Time 25°C to peak Temperature (TP)
Do not exceed
8 minutes Max
280°C
Revision April 24, 2018
3/4
@ UN Semiconductor Co., Ltd. 2018
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.