AD7091R-5BCPZ(Rev0) データシートの表示（PDF） - Analog Devices
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AD7091R-5BCPZ
(Rev.:Rev0)
(Rev.:Rev0)
Analog Devices
AD7091R-5BCPZ Datasheet PDF : 35 Pages
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AD7091R-5
Data Sheet
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
0.30
0.25
0.50
BSC
0.20
16
20
15
1
EXPOSED
PAD
PIN 1
INDICATOR
2.65
2.50 SQ
2.35
5
11
0.50
10
6
0.25 MIN
0.40
BOTTOM VIEW
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.
Figure 44. 20-Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-10)
Dimensions shown in millimeters
6.60
6.50
6.40
20
11
4.50
4.40
4.30
6.40 BSC
1
10
PIN 1
0.65
BSC
0.15
1.20 MAX
0.20
0.05
0.09
0.75
0.30
COPLANARITY 0.19
8°
SEATING
0°
0.60
0.45
0.10
PLANE
COMPLIANT TO JEDEC STANDARDS MO-153-AC
Figure 45. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Channels
AD7091R-5BCPZ
4
AD7091R-5BCPZ-RL7 4
AD7091R-5BRUZ
4
AD7091R-5BRUZ-RL7 4
EVAL-AD7091R-5SDZ
EVAL-SDP-CB1Z
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
Evaluation Board
Evaluation Controller Board
1 Z = RoHS Compliant Part.
Package Option
CP-20-10
CP-20-10
RU-20
RU-20
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2015 Analog Devices, Inc. All rights reserved. Trademarks and
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D12093-0-7/15(0)
Rev. 0 | Page 34 of 34
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