EMIF08-2005QEJ
Table 2: Absolute Ratings (Tamb = 25°C)
Symbol
Parameter and test conditions
VPP ESD discharge
EC61000-4-2 air discharge
IEC61000-4-2 contact discharge
Tj
Junction temperature
Tstg Storage temperature range
TL Maximum lead temperature for soldering
Value
Unit
± 15
±8
kV
125
°C
- 55 +150
°C
260
°C
Table 3: Electrical Characteristics (Tamb = 25 °C)
Symbol
Parameter
I
VBR Breakdown voltage
IF
IRM Leakage current @ VRM
VRM Stand-off voltage
VCL Clamping voltage
IPP Peak pulse current
VBR
VCL
VRM
VF
V
IRM
αT Voltage temperature coefficient
VF Forward voltage drop
RI/O
Cline
Series resistance between Input &
Output
Input capacitance per line
Slope = 1/Rd
IPP
Symbol
Test conditions
VBR IR = 1 mA
IRM VRM = 3V per line
Rd
IPP = 10A, tp = 2.5µs
RI/O
Cin
Vbias = 0V F = 1MHz Vosc = 30mV
Min. Typ. Max. Unit
6
8
10
V
500
nA
1
Ω
180
200
220
Ω
45
50
pF
2/6