EMA303D-1 データシートの表示（PDF） - Excelics Semiconductor, Inc.
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EMA303D-1 Datasheet PDF : 4 Pages
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DATA SHEET
17.5 - 26 GHz Medium Power MMIC
ASSEMBLY DRAWING
Vdd
0.1 uF
50 ohm line on Alumina
RF INPUT
50pF
EMA303D-1
50 ohm line on Alumina
RF OUTPUT
0.1 uF
50pF
VGG
The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and
separate the wires to minimize the mutual inductance.
CHIP OUTLINE
1060
GND
for DC check
VD 1
750
VD2
1500
VD3
2350
RF IN
680
RF OUT
550
0
0
700
VGG1
1150
VGG1
Chip Size 1060 x 2500 microns
Chip Thickness: 75 ± 13 microns
PAD Dimensions: 1. DC 100 x 100 microns
2. RF 80 x 68 microns
All Dimensions In Microns
GND
2065
VGG1
2500
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