
General purpose transistor
PACKAGE OUTLINE
Plastic surface mounted package
A
E
K
B
G
C
D
J
H
SOLDERING FOOTPRINT
0.50
Production specification
UMZ1N
SOT-363
SOT-363
Dim
Min
Max
A
2.00
2.20
B
1.15
1.35
C
0.95 Typical
D
0.25 Typical
E
0.25
0.40
G
0.60
0.70
H
0.02
0.10
J
0.10 Typical
K
2.2
2.4
All Dimensions in mm
1.90
Unit : mm
PACKAGE INFORMATION
Device
UMZ1N
Package
SOT-363
Shipping
3000/Tape&Reel
G030
Rev.A
www.gmicroelec.com
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