IRL3202SPbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
V(BR)DSS Drain-to-Source Breakdown Voltage
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
RDS(on)
VGS(th)
gfs
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
IDSS
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
LS
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Min. Typ. Max. Units
20 V
0.029 V/°C
0.019
0.016 Ω
0.70 V
28 S
25 µA
250
100 nA
-100
43
12 nC
13
9.8
100 ns
63
82
7.5 nH
2000
800 pF
290
Conditions
VGS = 0V, ID = 250µA
Reference to 25°C, ID = 1mA
VGS = 4.5V, ID = 29A
VGS = 7.0V, ID = 29A
VDS = VGS, ID = 250µA
VDS = 16V, ID = 29A
VDS = 20V, VGS = 0V
VDS = 10V, VGS = 0V, TJ = 150°C
VGS = 10V
VGS = -10V
ID = 29A
VDS = 16V
VGS = 4.5V, See Fig. 6
VDD = 10V
ID = 29A
RG = 9.5Ω, VGS = 4.5V
RD = 0.3Ω,
Between lead,
and center of die contact
VGS = 0V
VDS = 15V
= 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
I SM
Pulsed Source Current
(Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
48
A showing the
integral reverse
G
190
p-n junction diode.
S
1.3 V TJ = 25°C, IS = 29A, VGS = 0V
68 100 ns TJ = 25°C, IF = 29A
130 190 nC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by
max. junction temperature.
Starting TJ = 25°C, L = 0.64mH
RG = 25Ω, IAS = 29A.
ISD ≤ 29A, di/dt ≤ 63A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 150°C
Pulse width ≤ 300µs; duty cycle ≤ 2%.
Uses IRL3202 data and test conditions
** When mounted on FR-4 board using minimum recommended footprint.
For recommended footprint and soldering techniques refer to application note #AN-994.