2
Absolute Maximum Ratings[1] TC = +25°C
Symbol Parameter
Unit
If
Forward Current (1 µs Pulse) Amp
PIV Peak Inverse Voltage
V
Tj
Junction Temperature
°C
Tstg Storage Temperature
°C
θjc
Thermal Resistance[2]
°C/W
SOT-23
1
Same as VBR
150
-65 to 150
500
SOT-323
1
Same as VBR
150
-65 to 150
150
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to
the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins where
contact is made to the circuit board.
Electrical Specifications TC = +25°C (Each Diode)
Conventional Diodes
Part
Number
HSMP-
3810
3812
3813
3814
381B
381C
381E
381F
Package
Marking
Code
E0[1]
E2[1]
E3[1]
E4[1]
E0[2]
E2[2]
E3[2]
E4[2]
Lead
Code Configuration
Minimum
Breakdown
Voltage
VBR (V)
Maximum Maximum
Total
Total
Resistance Capacitance
RT (Ω)
CT (pF)
Minimum
High
Resistance
RH (Ω)
0 Single
100
3.0
0.35
1500
2 Series
3 Common Anode
4 Common Cathode
B Single
C Series
E Common Anode
F Common Cathode
Maximum
Low
Resistance
RL (Ω)
10
Test Conditions
VR = VBR
Measure
IR ≤ 10 µA
IF = 100 mA
f = 100 MHz
VR = 50 V
f = 1 MHz
IR = 0.01 mA IF = 20 mA
f = 100 MHz f= 100 MHz
High Frequency (Low Inductance, 500 MHz – 3 GHz) PIN Diodes
Part
Number
HSMP-
4810
481B
Package
Marking Lead
Code Code Configuration
EB
B[1] Dual Cathode
EB
B[2] Dual Cathode
Minimum Maximum Typical Maximum Typical
Breakdown Series
Total
Total
Total
Voltage Resistance Capacitance Capacitance Inductance
VBR (V)
RS (Ω)
CT (pF)
CT (pF)
LT (nH)
100
3.0
0.35
0.4
1.0
Test Conditions
Notes:
1. Package marking code is white.
2. Package laser marked.
VR = VBR
Measure
IR ≤ 10 µA
IF = 100 mA
VR = 50 V
f = 1 MHz
VR = 50 V
f = 1 MHz
VR = 0 V
f = 500 MHz –
3 GHz